Surface Mount Technology (SMT) Services in India For Electronics Manufacturing

Mobile : +91-8026430727
Email : rajat@eitpl.com

Surface Mount Technology Services

PCB assembly process for SMD electronic components. SMD components don’t have leads or with small leads. They are mounted on the surface of the circuit board. Where components are to be placed, the printed circuit board normally has flat, usually tin-lead, silver, or gold plated copper pads without holes, called solder pads. Solder paste, a sticky mixture of flux and tiny solder particles, is first applied to all the solder pads with a stainless steel or nickel stencil using a screen printing process. After pasting, the boards then proceed to the pick-and-place machines, where they are placed on a conveyor belt. The components to be placed on the boards are usually delivered to the production line in either paper/plastic tapes wound on reels or plastic tubes. Some large integrated circuits are delivered in static-free trays. Numerical control pick-and-place machines remove the parts from the tapes, tubes or trays and place them on the PCB.

The boards are then conveyed into the reflow soldering oven. They first enter a pre-heat zone, where the temperature of the board and all the components is gradually, uniformly raised. The boards then enter a zone where the temperature is high enough to melt the solder particles in the solder paste, bonding the component leads to the pads on the circuit board. The surface tension of the molten solder helps keep the components in place, and if the solder pad geometries are correctly designed, surface tension automatically aligns the components on their pads. Convection soldering is the most popular reflow technology using either standard air or nitrogen gas. After soldering, the boards may be washed to remove flux residues and any stray solder balls that could short out closely spaced component leads. Finally, the boards are visually inspected or by Machine through AOI ( Automatic Optical Inspection ) for missing or misaligned components and solder bridging. If needed, they are sent to a rework station where a human operator repairs any errors. They are then usually sent to the testing stations (in-circuit testing and/or functional testing) to verify that they operate correctly.

Contact Details

Corporate Office
East India Technologies Pvt. Ltd.
Add :  Survery No. 17, Kammanahalli, Bannerghatta Road,
Bangalore-560 076

Contact Person :  Mr. Rajat Bothra
Phone :  +91-80-26430727
Fax :  +91-80-26430493

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